Publications: [1] Zhang Yu, Kang Renke, et al. Mechanical effect of abrasives on silicon surface in chemo-mechanical grinding [J]. International Journal of Mechanical Sciences, 2023. [2] Zhang Yu, Kang Renke, et al. A new model of grit cutting depth in wafer rotational grinding considering the effect of the grinding wheel, workpiece characteristics, and grinding parameters[J]. Precision Engineering, 2021. [3] Kang Renke, Zhang Yu, et al. High surface integrity fabrication of silicon wafers using a newly developed nonwoven structured grind-polishing wheel, Journal of manufacturing processes, 2022 [4] Zhang Yu, Gao Shang, et al. Grinding Performance of Diamond Grinding Tools for Sapphire Crystal [J]. Advanced Materials Research, 2014. [5] Gao Shang, Li Honggang, Kang Renke,Zhang Yu,et al. Effect of strain rate on the deformation characteristic of AlN ceramics under scratching [J]. Micromachines, 2021. [6] Wang Ziguang, Yan feng, Zhang Yu, et al. The material deformation modes of monocrystalline gallium antimonide (GaSb) under nano-scratching [J]. Frontiers in materials, 2023. [7] Gao Shang, Huang Jinxing, Zhang Yu, et al. The grinding performance of a newly developed soft abrasive grinding wheel for silicon wafers during wet grinding process. The 23rd International Symposium on Advances in Abrasive Technology, Hokkaido, 2021, Japan. |
Academic Activities: Conference on diamond industry 2024,Zhengzhou, 2024/11/7-11/11. International Conference on Surface Finishing Technology and Surface Engineering, ICSFT2024, Taiyuan, 2024/8/7-8/9 |